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| Cu-Mo-Cu,
CPC, MoCu and WCu for Heat Sinks |
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| 1. Cu-Mo-Cu £¨CMC£©Rolled Composite Sheets
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1.1 Features
Cu-Mo-Cu is a sandwich composite comprised by a Molybdenum core
layer and two Copper clad layers. Cu-Mo-Cu rolled composite sheet
has the features as follows: |
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High thermal conductivity |
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Tailorable CTE matching semiconductor
and ceramic materials |
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Bigger size than WCu and Stamped components
available |
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No porosity |
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Very strong interface bonding can resist
850¡ãC repeatedly heat shock |
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No magnetic |
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| Cu/Mo/Cu (Thickness Rate) |
Density g/cm3 |
CTE 10-6/K |
Thermal Conductivity W/m.K |
Typical Size (mm) |
| In-plane |
Thru-thickness |
| 13:74:13 |
9.78-9.98 |
5.7-6.1 |
190-200 |
160-170 |
(0.35-3.5)x(50-150)x(100-400) |
| 1:4:1 |
9.70-9.90 |
6.8-7.2 |
210-220 |
170-180 |
| 1:3:1 |
9.60-9.80 |
7.7-8.1 |
240-250 |
180-190 |
| 1:2:1 |
9.48-9.68 |
8.5-8.9 |
270-280 |
200-210 |
| 1:1:1 |
9.27-9.47 |
9.6-10.0 |
300-310 |
220-230 |
(0.2-3.5)x(50-200)x(100-400) |
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| 2.CPC£¨Cu-Mo70Cu-Cu£©heat
sinks
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2.1 Features
CPC(Cu-Mo70Cu-Cu)
is a sandwich composite like Cu/Mo/Cu including a Mo70Cu alloy core
layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu
is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity
than that of WCu, MoCu, Cu/Mo/Cu and it is cheaper than them. All types of CPC
sheets can be stamped into components. |
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Large
sized sheets available (length up to 400mm, width up to 200mm) |
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More
easily to be stamped into components than CMC |
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Very strong interface bonding which can
repeatedly resist 850¡æ |
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Higher
thermal conductivity and lower cost |
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No magnetic |
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| Cu-Mo70Cu-Cu (Thickness Rate) |
Density g/cm3
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CTE 10-6/K |
Thermal Conductivity W/m.K |
| X direction |
Y direction |
In-plane |
Thru-thickness |
| 1:4:1 |
9.46 |
7.2 |
9.0 |
210-220 |
170-180 |
| 3. MoCu Sintered Alloys
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3.1 Features
MoCu
alloys are made from Mo and Cu by sintered. MoCu sheet is much lighter
than
W-Cu, so it is more suitable for aeronautic and astronautic applications.
MoCu
has the features as follows: |
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High
thermal conductivity |
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Tailorable
CTE (Coefficient of Thermal Expansion) matching semiconductor and
ceramic
materials |
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Relatively
low density |
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MoCu
sheet can be stamped when Mo less than 70% |
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Nickel
and Gold plated parts available |
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No magnetic |
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| Type |
Typical Property |
Typical Size (mm) |
| Content wt% |
Density
g/cm3 |
CTE 10-6/K |
Thermal Conductivity
W/m.K |
| Mo70Cu |
Mo 70¡À1 |
Cu bal. |
9.6-9.8 |
7.8-8.4 |
190-200 |
(0.5-3.0)x50x200 |
| Mo60Cu |
Mo 60¡À1 |
Cu bal. |
9.5-9.7 |
9.0-9.6 |
200-220 |
(0.3-3.0)x60x250 |
| Mo50Cu |
Mo 50¡À1 |
Cu bal. |
9.3-9.5 |
10.1-10.7 |
220-250 |
| 4. Tungsten-Copper for Heat Sinks |
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4.1 Alloys and Properties
As
high performance materials, Tungsten-Copper and Molybdenum-Copper
are
characterized by high thermal conductivity; low thermal expansion
and high wear
resistance combined with excellent electrical conductivity. |
| Type |
Typical Property |
Typical Size (mm) |
Density
g/cm3 |
CTE 10-6/K |
Thermal Conductivity
W/m.K |
| WCu10 |
16.6-17.0 |
5.6-6.3 |
180-190 |
(1.0-3.0)x40x80 |
| WCu15 |
16.2-16.6 |
6.3-7.0 |
190-200 |
(1.0-3.0)x40x80 |
| WCu20 |
15.4-15.8 |
7.8-8.5 |
200-220 |
(0.5-3.0)x60x100 |
| WCu25 |
14.8-15.2 |
9.5-10.2 |
220-240 |
(0.5-3.0)x60x100 |
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| 5. Applications |
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5.1
CMC, CPC & MoCu Applications
Microwave
Carriers, Hermetic Package Bases and Housings, Ceramic Substrate Carriers, GaAs
and Silicon Device Mounts, Laser Diode Mounts, Optical Packages, Power Packages,
Core Layer of High-performance PCBs and BGA Packages etc. Cu-Mo-Cu is especially
used in LED
packages and modules for heat sinks. Cu-Mo-Cu in big dimension is being
developed for laser components used for rear projection TV. Because
Cu-Mo-Cu has high thermal conductivity as well as low CTE, it can be used
instead of Copper, Aluminum and Silicon.
5.2
WCu Applications
Heat
Sinks and Spreaders, Microwave Carriers, Hermetic Package Bases and Housings,
Ceramic Substrate Carriers, GaAs and Silicon Device Mounts, Laser Diode
Mounts.
By
controlling the content of tungsten, we can design its coefficient of thermal
expansion (CTE) matching that of the materials as follows: |
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Semiconductors:
Si, GaAs, SiGe, SiC, InGaP, InGaAs, InAlGaAs, AlGaInP and AlGaAs |
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Ceramics:
Al2O3, BeO, AlN and so on. |
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Metals:
Kovar, FeNi42 and so on. |
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